Building on our solid Mac debut product, Punch! Home Design Studio Pro is a robust release, which also brings to the design table the following new features

Genre: Graphics & Design[/center]
Brand New! Logo Design Studio™ Pro - Vector Edition. Now you can create logo designs and other graphic illustrations like a pro using Logo Design Studios new vector drawing and editable vector graphics software. Vector design means no more size limitations, so you can have razor sharp graphics from business cards to billboards! Youll get: 2,000+ completely new logo templates - 6,000+ editable vector graphics - Perfect for any amateur or expert!

Autodesk 3ds Max Design 2012 software delivers powerful new rendering toolsets, enhanced iterative workflows, and an accelerated graphics core that together help increase overall productivity.

The electromagnetic simulation software CST STUDIO SUITE™ is the culmination of many years of research and development into the most efficient and accurate computational solutions to electromagnetic design. It comprises CST’s tools for the design and optimization of devices operating in a wide range of frequencies – static to optical. Analyses may include thermal and mechanical effects, as well as circuit simulation. All programs are accessible through a common interface with facilitates circuit and multi-physics co-simulation.

Autodesk 3ds Max Design 2012 software delivers powerful new rendering toolsets, enhanced iterative workflows, and an accelerated graphics core that together help increase overall productivity.

Autodesk 3ds Max Design 2012 software delivers powerful new rendering toolsets, enhanced iterative workflows, and an accelerated graphics core that together help increase overall productivity.

Autodesk 3ds Max Design 2012 software delivers powerful new rendering toolsets, enhanced iterative workflows, and an accelerated graphics core that together help increase overall productivity.

Autodesk® Building Design Suite Ultimate 2012 software is ideally suited for construction professionals and provides an advanced set of comprehensive tools for design and construction in a single economical and convenient package. Take advantage of Building Information Modeling (BIM) workflows with this construction design software suite.

A complete, authoritative guide to designing and building LED systems

Light-emitting diodes (LEDs) are expected to drive huge growth in the lighting industry. The new high-performance LEDs require a new level of knowledge to manage their higher light output, power requirements, and thermal management. Written by authorities in the field, this practical guide helps readers navigate the day-to-day engineering and systems design necessary to build complete LED systems, offering thorough information on the fields of optical performance, power, materials, thermal design, and modeling and measurement.

Selecting and bringing together matter provided by specialists, this project offers comprehensive information on particular cases of heat exchangers. The selection was guided by actual and future demands of applied research and industry, mainly focusing on the efficient use and conversion energy in changing environment. Beside the questions of thermodynamic basics, the book addresses several important issues, such as conceptions, design, operations, fouling and cleaning of heat exchangers. It includes also storage of thermal energy and geothermal energy use, directly or by application of heat pumps. The contributions are thematically grouped in sections and the content of each section is introduced by summarising the main objectives of the encompassed chapters. The book is not necessarily intended to be an elementary source of the knowledge in the area it covers, but rather a mentor while pursuing detailed solutions of specific technical problems which face engineers and technicians engaged in research and development in the fields of heat transfer and heat exchangers.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each tasks unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the books areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Whether you are an RF transistor designer, an amplifier designer or a system designer, this is your one-stop guide to RF and microwave transistor power amplifiers. A team of expert authors brings you up to speed on every topic, including: devices (Si LDMOS and VDMOS, GaAs FETs, GaN HEMTs), circuit and amplifier design (discrete, hybrid and monolithic), CAD, thermal design, reliability, and system applications/requirements for RF and microwave transistor amplifiers. Covering state-of-the-art developments and emphasising practical communications applications, this is the complete professional reference on the subject.